28 Apr, 2017

KARIYA, TOKYO (Japan) – DENSO Corporation and Toshiba Corporation today announced that the two companies have begun talks to enhance collaborations in the fields of Internet of Things (IoT)-based manufacturing, advanced driver assistance, automated driving, and others.

The collaborations aim to combine DENSO’s high level of technology and manufacturing capability accumulated through its experience in the automotive market and Toshiba’s image recognition, IoT, artificial intelligence (AI), and software development technologies, in order to increase the competitiveness to make it through the paradigm shift that is taking place in the automotive industry.

In the fields of advanced driver assistance and automated driving, DENSO and Toshiba have jointly developed AI technologies used in image recognition systems. Moreover, the two companies have worked together in a wide range of areas including the development of automotive lithium-ion battery packs and software for ECUs used in automotive components.

DENSO and Toshiba will collaborate more closely in fields where they can share their visions and speed up the development of technology.

Information in the press releases, including product prices and specifications, content of services and contact information, is current on the date of the press announcement, but is subject to change without prior notice.

Toshiba Corporation- Semiconductor and Storage Products Company　Website＞
http://toshiba.semicon-storage.com/ap-en?mm=cp170428&no=03

 

 

Visit Chip1Stop Chinese site
Visit Chip1Stop Korean site
Visit Chip1Stop English site
Visit Chip1Stop German site

Companies Website:
http://toshiba.semicon-storage.com/ap-en?mm=cp170428&no=03

Toshiba News Release

• Toshiba Starts Test-Sample Shipments of a Bare Die 1200V SiC MOSFET with Low On-Resistance and High Reliability, for Use in Automotive Traction Inverters

  2024/11/13Toshiba  Automotive

• Toshiba Starts Sample Shipments of Gate Driver IC for Three-Phase Brushless DC Motors in Diverse Automotive Applications

  2024/11/01Toshiba  Automotive

• Toshiba Releases Automotive Photorelay with Output Withstand Voltage of 900V, Housed in a Small Package

  2024/10/28Toshiba  Automotive

• Toshiba’s 1200V Additions to its Lineup of Third-Generation SiC Schottky Barrier Diodes Will Contribute to High Efficiency in Industrial Power Equipment

  2024/09/26Toshiba  Power Supply

• Toshiba Is Sampling an Automotive CXPI Responder Interface IC that Contributes to Shorter Software Development Times

  2024/09/05Toshiba  Automotive

Related News Release

• STMicroelectronics introduces first STM32-ready wireless IoT modules leveraging collaboration with Qualcomm

  2024/12/24  STMicroelectronics  IoT

• Web-based tool from STMicroelectronics accelerates AIoT projects with smart sensors

  2024/11/29  STMicroelectronics  IoT

• STMicroelectronics delivers industry’s first FIPS 140-3 certified TPMs for computer, server, and embedded systems

  2024/10/03  STMicroelectronics  IoT

• Industry-first embedded SIM from STMicroelectronics supports new standard expected to revolutionize bulk IoT device management

  2024/06/26  STMicroelectronics  IoT

• STMicroelectronics’ NFC reader brings outstanding performance-to-cost ratio of embedded contactless interaction to high-volume consumer and industrial devices

  2024/04/12  STMicroelectronics  IoT