The robust HSAutoLink™ II sealed system deliversdata rates up to 5 Gbps, supporting high-speedmedia protocols including USB3.0, to meet increasingbandwidth requirements for advanced in-vehicleinfotainment, telematics and camera devices

A dominating trend in automotive electronics is the proliferation of invehiclecameras for intelligent driver assistant systems. For example, lanedeparturewarning, collision avoidance and parking-assist all make use ofup to six cameras positioned at various locations on the vehicle. Togetherwith a move from analog technology to digital, higher resolution and 24-bit colour imagery, these are increasing the bandwidth requirements forautomotive and commercial vehicles.

The next generation HSAutoLink™ II Interconnect System addresses theseevolving requirements by providing a robust, sealed and cost-competitivesystem of shielded cable assemblies and mating headers with data ratesup to 5 Gbps. Available in 6 and 12 circuits, the system supports highspeedcommunication technologies, including LVDS, USB2.0, USB3.0 andDisplayPort for rugged applications in the transportation industry.

Instrumental in the introduction of high-speed connection systems in theautomotive industry, Molex designed the first generation HSAutoLink™system with a USCAR-30 interface. Molex also has extensive expertise inhigh-speed data transmission in markets outside transportation, includingtelecommunications and consumer electronics. For further information visit:http://www.molex.com/link/hsautolink2.html

 

 

 

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