February 23, 2016

 

TOKYO — Toshiba Corporation’s (TOKYO: 6502) Semiconductor & Storage Products Company today announced the launch of the “HK4R Series” and the “HK4E Series” of enterprise SSDs integrating NAND chips fabricated with 15nm MLC process technology. Sample shipments start from today.

The new products are Toshiba’s first enterprise SSDs integrating 15nm MLC NAND flash memory. The line-up including products with double the capacity of conventional Toshiba products[1] were developed utilizing the technology. These SSDs expand Toshiba’s enterprise storage solutions and flexibly meet various diversified requirements of the rapidly growing enterprise market.

The SSDs are equipped with Toshiba’s proprietary QSBC (Quadruple Swing-By Code) error correction technology, a highly efficient error correction code (ECC). Along with the power loss protection and data protection features, it helps strengthen the protection of customer data and enhances reliability.

The HK4R Series is capable of one DWPD[2] endurance, and is available in capacities up to 1920GB[3], and suited for enterprise applications including web servers, files servers, media streaming, video-on-demand, search engines and warm data storage.

The HK4E Series of value-endurance drives offer an endurance level of three DWPD and capacities up to 1600GB. It is suited for e-mail servers and data centers.

Toshiba will continue strengthening its SSD lineup, meeting the various needs of users and leading the continuously expanding SSD market.

Outline of the New Products

“HK4R Series”

 

“HK4E Series”

 

[1] Compared with the HK3R2 series and the HK3E series.

[2] DWPD: Drive Write Per Day. One full drive write per day means the drive can be written and re-written to full capacity once a day every day for five years, the stated product warranty period. Actual results may vary due to system configuration, usage and other factors.

[3] Definition of capacity: Toshiba defines a megabyte (MB) as 1,000,000 bytes and a gigabyte (GB) as 1,000,000,000 bytes. A computer operating system, however, reports storage capacity using powers of 2 for the definition of 1GB = 230 = 1,073,741,824 bytes and therefore shows less storage capacity. Available storage capacity (including examples of various media files) will vary based on file size, formatting, settings, software and operating system, such as Microsoft Operating System and/or pre-installed software applications, or media content. Actual formatted capacity may vary.

[4] Toshiba defines a kibibyte (KiB) as 1,024 bytes (210) and a mebibyte (MiB) as 1,048,576 bytes (220).

Read and write speed may vary depending on the host device, read and write conditions, and file size.

Follow this link for more on the new products.

 

“HK4R Series”

http://toshiba.semicon-storage.com/ap-en/product/storage-products/enterprise-ssd/hk4r.html?mm=cp160224&no=09

 

“HK4E Series”
http://toshiba.semicon-storage.com/ap-en/product/storage-products/enterprise-ssd/hk4e.html?mm=cp160224&no=10

Follow this link for more on Toshiba enterprise SSDs.
http://toshiba.semicon-storage.com/ap-en/product/storage-products/enterprise-ssd.html?mm=cp160224&no=11

Information in this document, including product prices and specifications, content of services and contact information, is current on the date of the announcement but is subject to change without prior notice.

Toshiba Corporation- Semiconductor and Storage Products Company　Website＞http://toshiba.semicon-storage.com/ap-en?mm=cp160224&no=12

 

Visit Chip1Stop Chinese site
Visit Chip1Stop Korean site
Visit Chip1Stop English site
Visit Chip1Stop German site

Companies Website:
http://toshiba.semicon-storage.com/ap-en?mm=cp160224&no=12

Toshiba News Release

• Toshiba Starts Test-Sample Shipments of a Bare Die 1200V SiC MOSFET with Low On-Resistance and High Reliability, for Use in Automotive Traction Inverters

  2024/11/13Toshiba  Automotive

• Toshiba Starts Sample Shipments of Gate Driver IC for Three-Phase Brushless DC Motors in Diverse Automotive Applications

  2024/11/01Toshiba  Automotive

• Toshiba Releases Automotive Photorelay with Output Withstand Voltage of 900V, Housed in a Small Package

  2024/10/28Toshiba  Automotive

• Toshiba’s 1200V Additions to its Lineup of Third-Generation SiC Schottky Barrier Diodes Will Contribute to High Efficiency in Industrial Power Equipment

  2024/09/26Toshiba  Power Supply

• Toshiba Is Sampling an Automotive CXPI Responder Interface IC that Contributes to Shorter Software Development Times

  2024/09/05Toshiba  Automotive

Related News Release

• Winbond’s LPDDR4/4X: A Green Solution for the Automotive Industry

  2024/11/29  Winbond Electronics  Processor/Memory

• STMicroelectronics reveals Page EEPROM two-in-one memory to boost smart-edge performance and efficiency

  2024/10/08  STMicroelectronics  Processor/Memory

• Winbond has unveiled its latest 1Gb QspiNAND for Wearable and Low-Power IoT Devices.

  2024/08/08  Winbond Electronics  Processor/Memory

• STMicroelectronics powers up the intelligent edge with second-generation STM32 microprocessors, bringing performance boost and industrial resilience

  2024/03/18  STMicroelectronics  Processor/Memory

• Winbond Introduces Innovative CUBE Architecture for Powerful Edge AI Devices

  2023/09/27  Winbond Electronics  Processor/Memory