2022/02/13 |
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PCN(Product Change Notice)
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Qualification of HFTF as additional Assembly site for select devices |
2022/04/14 |
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PCN(Product Change Notice)
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Qualification of HFTF as additional Assembly site for select devices
Revision A is to update the description of change to include a change in mold compound for the proposed change. We apologize for any inconvenience this may have caused.
Proposed 1st Ship Date: Apr 14, 2022
ASESH HFTF Mold Compound EN2000763 R-30
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2024/04/22 |
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PCN(Product Change Notice)
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Texas Instruments Incorporated is announcing the qualification of additional Assembly sites for devices listed below in the product affected section.
Proposed 1st Ship Date: July 17, 2024 |
2024/06/26 |
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PCN(Product Change Notice)
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Qualification of RFAB using qualified Process Technology, Die Revision & BOM~option for select devicess |
2024/07/01 |
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PCN(Product Change Notice)
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Supplier Notice No.:20240625003.0 Title: Datasheet for TCA9617A
Description of Change: Texas Instruments Incorporated is announcing an information only notification. The product datasheet(s) is being updated as summarized below.
The datasheet number will be changing. Device Family/TCA9617A Change From: SCPS244BChange To:SCPS244C
Reason for Change: To accurately reflect device characteristics.
Anticipated impact on Fit, Form, Function, Quality or Reliability (positive / negative): No anticipated impact. This is a specification change announcement only. There are no changes to the actual device |