2020/09/15 |
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PCN(Product Change Notice)
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PRODUCT CHANGE NOTIFICATION |
2020/12/04 |
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PCN(Product Change Notice)
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PRODUCT CHANGE NOTIFICATION REV 2: This interim update provids a partial listing of affected part numbers for which qualification is complete for the changes listed in the title of the tables below. An additional Diodes internal assembly and test site (SAT) in Shanghai, China is also being added for products listed in table 4 below. Qualification / reliability reports are attached (embedded in this file). For other associated changes (identified in the Advance version (Rev 1) of PCN-2477 released August 17th, 2020) qualification testing is ongoing. Updates and qualification data will be provided in the Final version of this PCN. The final PCN is expected to be issued by January 31st, 2021 once all qualification has been completed. |
2021/03/09 |
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PCN(Product Change Notice)
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2477 REV 3 – FINAL UPDATE : Additional Wafer Source (GFAB), Additional Assembly/Test (A/T) Site (SAT), and Transfer Assembly/Test Site to DIYI |
2022/06/08 |
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PCN(Product Change Notice)
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Diodes Incorporated has qualified additional clip bonding, lead frame structure~(Matrix), and mold compound at Diodes subcontractor Eris Technology Corp. (ERIS~located in Taoyuan City, Taiwan for select discrete products. Diodes~Incorporated has also qualified internal assembly and test (A/T) site (SSEC)~located in Shanghai, China as an additional A/T site for select products |
2022/06/08 |
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PCN(Product Change Notice)
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Diodes Incorporated has qualified additional clip bonding, lead frame structure~(Matrix), and mold compound at Diodes subcontractor Eris Technology Corp. (ERIS~located in Taoyuan City, Taiwan for select discrete products. Diodes~Incorporated has also qualified internal assembly and test (A/T) site (SSEC)~located in Shanghai, China as an additional A/T site for select products |
2022/09/01 |
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PCN(Product Change Notice)
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Assembly Site/Material Change Qualification of Additional Clip Bonding, Lead Frame Structure (Matrix) and Mold Compound, and Qualification of Additional Diodes Internal Assembly & Test Site (SSEC) for Select Discrete Products Implementation Date : 1 September, 2022 |
2024/05/08 |
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PCN(Product Change Notice)
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Updated document, Reason of update: Diodes Incorporated has qualified Diodes~internal wafer fabrication source (JKFAB) in Hsinchu, Taiwan as additional~wafer source for select discrete products listed. |
2024/06/26 |
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PCN(Product Change Notice)
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This PCN is being issued to notify customers that in order to assure continuity of supply, Diodes Incorporated has qualified Diodes internal wafer fabrication source (JKFAB) in Hsinchu, Taiwan as additional wafer source for select discrete products listed below. Top metal (TM) and back metal (BM) will be processed at Diodes internal wafer fabrication (KLFAB) in Keelung, Taiwan. |