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・根据顾客的购买情况可以享受优惠和折扣
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PCN/PDN/NRND信息

PCN(产品/工艺变更通知)和PDN(生产中断通知)信息。

通知日期 通知文书 通知类型 通知信息
2020/08/13 PCN(产品规格变更通知) Product/Process Change Notice
ADI is transferring some of the products currently manufactured using the 0.6μm BICMOS process from wafer fab facility located at 275 S.
Hillview Dr., Milpitas, CA, USA to Vanguard International Semiconductor, Taiwan. See Appendix 1 for the list of affected part numbers. The
affected products will be manufactured using ADI specified manufacturing flows, materials, process controls, and monitors ensuring no degradation of quality and reliability performance. No new products are being released in the Hillview wafer fab and all affected products will be transferred to the Vanguard wafer fab by the end of calendar year 2020 and will cease to be manufactured in the Hillview facility by February 2021.
2021/08/11 PCN(产品规格变更通知) Notification of Wafer Fab Location Change for 0.6μm BICMOS Process Devices
from ADI Milpitas (Hillview) to Vanguard Int. (Taiwan)
Effectivity Date: 30-Oct-2021
2022/10/11 PCN(产品规格变更通知) Epoxy Change from Henkel 8290 to 8290A for MSOP Package
EffectivityDate: 11-Oct-2022 (the earliest date that a customer could expect to receive changed material)
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