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PCN/PDN/NRND信息

PCN(产品/工艺变更通知)和PDN(生产中断通知)信息。

通知日期 通知文书 通知类型 通知信息
2021/07/16 PCN(产品规格变更通知) Notices of supplier addition to mold compound list
2021/07/30 PCN(产品规格变更通知) Description of Change:
Additional mold compound supplier,
which is already a known supplier for other products.
Reason for Change:
Increase of production flexibility & product supply stability
Schedules:
Requested approval August 2021
Change Implementation August 2021 onwards
2025/01/16 PCN(产品规格变更通知) The die bond material for H8, H8S, H8SX, and SH family surface mount package products will be changed.
Affected back-end processing base: Renesas Semiconductor (Suzhou) Co., Ltd
(hereinafter referred to as [Suzhou])
The die bond material to be changed will be a material
that has a proven track record in mass production at [Suzhou].

Scheduled start date of shipment: 5/1/2025
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