The partnership formalizes collaboration between the two companies to optimize integration and performance  and  assure  long-term  availability  of  Winbond  and  ST  devices,  to  meet  the  needs  of customers serving industrial markets. 

“This  partnership  means  product  developers  can  confidently  integrate  our  memory  with  STM32 devices,” said Tetsu HO, Winbond DRAM Technology Manager. “Our memories are the perfect choice for embedded projects, offering attributes such as small size, power-saving design, and low pin-count packages that simplify interconnection and save PCB cost.” 

The STM32 family is the market leader in MCUs and MPUs built on industry-standard Arm® Cortex 32-bit cores. They combine high performance and energy efficiency with super-low power consumption, advanced  peripherals,  and  the  extensive  STM32  ecosystem  that  comprises  software,  tools,  and evaluation boards and kits to simplify and accelerate development.  

 “STMicroelectronics and Winbond are happy to announce a close partnership around STM32MPU families.  Indeed,  ST  as  a  global  leader  on  General  Purpose  MCUs,  ST  is  extending  is  family  to STMP32MPUs, for that we need to have strong memory DRAM provider to support and provide all our customers.” said >. 

Currently,  the  partnership  has  focused  on  combining  Winbond’s  DDR3  (double  data-rate  3 rd  generation) dynamic RAM with ST’s STM32MP1 MPUs, which contain up to two Cortex-A7 cores and integrate features including advanced peripherals, IoT-security hardware, and high-efficiency power conversion  circuitry  on-chip.  Winbond’s  DDR3  supports  the  MPU’s  memory  buffer  to  enhance performance in applications such as industrial gateways, data concentrators, smart meters, barcode readers, smart-home devices, and numerous applications that require both high performance and state-of-the-art security. 

In addition, ST and Winbond have collaborated to ensure that Winbond’s HYPERRAM provides ideal support for the memory buffer of ST’s recently announced STM32U5 ultra-low-power MCUs based on the advanced Cortex-M33 core. HYPERRAM allows replacement of older interfaces like SDR and earlier DDR generations to realize whole-system power savings. It betters the performance of conventional pSRAM and permits a high-speed, low-cost, low pin-count, and super-low-power solution consistent with the ultra-low-power STM32U5.  Winbond’s extensive portfolio containing HYPERRAM, DDR3, LPDDR4/4X, DDR4and other Mobile and Specialty DRAM is available through distributors and online. Please visit www.winbond.com for more details. 

 

About Winbond 

Winbond Electronics Corporation is a total memory solution provider. The Company provides customer-driven memory solutions backed by the expert capabilities of product design, R&D, manufacturing, and sales services. Winbond’s product portfolio, consisting of Specialty DRAM, Mobile DRAM, Code Storage Flash, and TrustME® Secure Flash, is widely used by tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets. Winbond is headquartered in Central Taiwan Science Park (CTSP), and it has subsidiaries in the USA, Japan, Israel, China and Hong Kong, and Germany. Based on Taichung and Kaohsiung 12-inch fabs in Taiwan, Winbond keeps pace to develop in-house technologies to provide high-quality memory IC products. 

Winbond is a registered trademark of Winbond Electronics Corporation. All other trademarks and copyrights mentioned herein are the property of their respective owners. 

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