45. Types of IC packages

1 direction

Insert mounting type

SIP

Single In-line Package

The package density can be raised although it becomes high profile as the lead is vertically arranged in a long boundary line of the package. It is not only for IC but also used for the network resistor.

SSIP

Shrink Single In-line Package

HSIP

Single In-line Package with Heatsink

ZIP

Zigzag In-line Package

It is named ZIP because the lead that came out vertically from one side is arranged by mutual folding in zig-zag shape. Though it resembles SIP, the lead pitch can be narrowed by processing the lead in zig-zag shape, and the width (long boundary) can be narrowed compared with SIP. Although it was developed as a replacement for DIP to raise the package density for DRAM, and later it was made to substitute for surface-mount package TSOP. At present, it is used for some of Analog IC.

SZIP

Shrink Zigzag In-line Package

2 way direction

Insert mounting type

DIP

Dual In-line Package

DIP was invented in 1965, and was very popular in IC package till 1980’s as it is suitable for mounting IC. Later, it loose its polularity and taken over by PLCC and SOIC which were invented as package for the surface mounting however it is still used widely for such as general purpose Logic, EPROM.The lead is stretched from both sides of package length boundary towards downward. Ceramic DIP is called CerDIP (CER-DIP), and the plastic one is called as PDIP (PDIP).

SDIP

Shrink Dual In-line Package

CDIP

Ceramic Dual In-line Package

WDIP

DIP with Window Package

Surface-mounted device

SOP

Small Outline Package

It is widely used typical surface mounting item. SOP makes the lead interval of DIP into half, and expands the lead for the surface mounting to the external Gull’s wing shape (Gull Wing). Further, the lead pin extending out from 4 way directions of the package is called QFP. SSOP, TSOP, are developed as a derivation of SOP. Another name of SOP is called SOIC, JEDEC standard are called SOIC in the United States, and JEITA standard one is called SOP in Japan, and the body width of the former one is larger than the latter.

SSOP

Shrink Small Outline Package

TSOP

Thin-Small Outline Package

TSSOP

Thin-Shrink Small Outline Package

MSOP

Mini( Micro) Small Outline Package

QSOP

Quarter Small Outline Package

SOIC

Small Outline Integrated Circuit

SOICW

Small Outline Integrated Circuit Wide

SOJ

Small Outline J-leaded package

It was developed to reduce space required on the substrate more than DIP. The lead goes out of both sides around the length of the package, and winding towards internal side so that the tips hold the package body. When seen from the transverse side, the lead looks like “J” shape, so it it called SOJ. The surface is mounted with solder to the bending section. It has been using popular package from 256 Kbit product in DRAM, later it was replaced by TSOP. The memory capacity is comparatively small. It is still used in a section of RAM.

SON

Small Outline Non-leaded package

There is no lead, instead the electrode pad is prepared as the terminal for the connection. QFN is arranged to 4 way direction, whereas the SON is the package for low pin, and it is 2 way direction type.

VSON

Very-thin Small Outline Non-leaded package

Contact mounting type

DTP

Dual Tape carrier Package

It is the resin coated package where the IC chip is connected by the TAB(Tape Automated Bonding) technology with the wiring pattern formed tape. Generally, it is called TAB. This package is suitable for multi pin, high-density package.

4 way direction

Surface-mounted device

QFP

Quad Flat Package

Externals shape is in square shape, and the Gull-wing lead protrude from the 4 borders. The material is sealed with ceramic package by epoxy resin, injection molding by melted plastic.

TQFP

Thin Quad Flat Package

STQFP

Small Thin Quad Plastic Flat Package

FQFP

Fine-pich Quad Flat Package

HQFP

Quad Flat Package with Heat sink

LQFP

Low profi le Quad Flat Package

VQFP

Very-small Quad Flat Package

MQFP

Metric Quad Flat Package

QFJ

Quad Flat J-leaded package

The lead has extended from the 4 borders to the side of the packages similar to QFP. The tip point of the lead is bent internally like the J shape similar to SOJ. PLCC is QFJ of plastic, and the package code of JEITA is comparable to PQFJ. It is necessary to note that it is completely different although the name looks like LCC.

QFN

Quad Flat Non-leaded package

The electrode pad lies along the 4 boundaries of the bottoms. The electrode pad is exposed from the side to the bottom in case the electrode pad is only at the bottom. The mounting area is smaller than QFP, so flat-panelization, density growth is possible. LCC is a package where the lead wire is not extended, in which electrode pad is installed on the ceramic surface. It is comparable to CQFN in the package code of JEITA.

TQFN

Thin-Quad Flat No-Lead Plastic package

LCC

Leaded Chip Carrier

CLCC

ceramic leaded chip carrier

DFN

Dual Flat package

QFI

Quad Flat I-leaded package

Contact mounting type

QTP

Quad Tape-carrier Package

It is the resin coated package same as DTP where the IC chip is connected by TAB(Tape Automated Bonding) technology to the wiring pattern formed tape. Generally, it is called TAB. This package is suitable for multi pin, high-density package.

Matrix

Insert mounting type

PGA

Pin Grid Array

The pin is lined up in array shape on the package. Depending on the material of the package, ceramic made is called CPGA (Ceramic-PGA), and plastic made is called PPGA(Plastic-PGA). It was adopted for CPU in the personal computer, and it was leading in high efficiency multi pin package until the BGA described later appeared. At present plastic PGA is hardly used, and ceramic PGA is used as a part of high-end usage. In SPGA, the pin is arranged like the plover shape.

SPGA

Staggered Pin Grid Array

Surface-mounted device

BGA

Ball Grid Array

A spherical shape solder ball is lined up in array shape as terminal at the package bottom. Wire bonding and the flip-chip joins between Multiple core and interposer, sealed with resin. A BGA can provide more interconnection pins as well as high density of pins. There is a maker who declares as “FCBGA” for the flip-chip joint. Compared with QFP, it has an advantage of soldering quality and high efficiency of packaging to PCB. However, as it requires advanced packaging technology, it is difficult to modify, replace, test and maintenance.

EBGA

Enhanced BGA

FTBGA

Flex Tape BGA

TFBGA

Thin & Fine-Pitch Ball Grid Array

LGA

Land Grid Array

The electrode pad such as copper at the bottom in the package are alligned in an array and makes the terminal.It is ideal package for high speed and high frequency operation because parasitic inductance of the terminal is less. Moreover, LGA does not have solder ball, and possible to lower the height ofpackage compared with BGA . It is classified as LGA even if Solder ball is used when the size of solder balls are 0.1mm or less in the JEITA standard.