2020/02/24 |
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PCN(製品仕様変更通知書)
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Intel® is notifying customers of a minor change to the content of custom barcode labels on the immediate, intermediate, and shipping containers (e.g. Moisture Barrier Bag (MBB), Inner Box, Reel, Shipping Box). The words “RoHS Compliant” will no longer be printed on the labels. This is only a label content change. There is no change to the product materials. This is not a notification of change to RoHS Compliance status of the product.
[Change From] “RoHS COMPLIANT” printed on the lower left of the barcode label
[Change To] “RoHS COMPLIANT” not printed on the barcode label. *During transition period, customers may or may not see “RoHS compliant” printed on the label. |
2020/04/07 |
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PCN(製品仕様変更通知書)
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This revision is the same one communicated as a follow up to PCN1912, issued on March 13, 2020.
Reason for Revision: Corrected hyperlink to affected products Intel is announcing the addition of the Advanced Semiconductor Engineering Inc., Malaysia (ASEM) as an alternate assembly site of selected Cyclone III and Cyclone IV devices. This is the same change described in PCN1912 issued on August 09, 2019. ASEM is a long-time qualified, high-volume assembly site for Cyclone 10 LP devices, which have the same package type as Cyclone III and Cyclone IV E. |
2024/01/25 |
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PDN(製品製造中止通知書)
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Intel’s Outsourced Semiconductor Assembly and Test (OSAT) vendor is phasing out its non-green plating production line. |