2020/12/16 |
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PCN(製品仕様変更通知書)
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NXP Will Add a Sealed Date to the Product Label * Since there are many applicable products, this notification is divided and notified. Therefore, depending on your purchase history, notifications may be sent in multiple notifications, but the following notifications will all be the same. PP0000724692/93/94/95/96/98 |
2022/09/15 |
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PCN(製品仕様変更通知書)
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Maintaining Final Test Second Source Capability: ATTJ to ATTJ-B2 Qualification Results Effective date:Sep 15, 2022 |
2023/08/23 |
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PCN(製品仕様変更通知書)
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NXP Semiconductors announces the qualification of a stamped leadframe, replacing the current etched leadframe, for the SOIC 32 lead exposed pad devices associated with this notification. The stamped leadframe products are now qualified for assembly at NXP-ATTJ assembly site, Tianjin China. No change to leadframe base metal material, plating or overall dimensions - except for minor change to exposed pad area shape - but with no impact to exposed pad overall dimensions. |
2023/09/08 |
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PCN(製品仕様変更通知書)
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New MC33972 data sheet revision 20.0 and new MC33975 data sheet revision 12.0 are now available. |