2021/12/01 |
|
PCN(製品仕様変更通知書)
|
Marking Process Change Starting from December 1st, 2021 the marking of the SOT-227B package will change from inkjet marking to laser marking. |
2024/06/06 |
|
PCN(製品仕様変更通知書)
|
Supplier will comfirm devices affected and provide a list of devices actually~converting |
2024/06/13 |
|
PCN(製品仕様変更通知書)
|
Supplier Notice No.:PCN47-IDM-24 Title: Carling Passivation and Plating Supplier Transition
Description of the Change: We will be transitioning away from the supplier who performed metal component passivation and plating processes on the attached finished goods.
Reason for The Change: The current supplier of these services has informed us that it is no longer in their strategy to provide such services on the components we require.
Effective Date of the Change: This will be conducted as a running change, effective immediately. |
2024/06/21 |
|
PCN(製品仕様変更通知書)
|
Supplier will comfirm devices affected and provide a list of devices actually~converting |
2024/08/10 |
|
PCN(製品仕様変更通知書)
|
IXYS サイリスタおよびダイオード のディスクリートパッケージ製品の新たな エポキシ成型コンパウンド材 EMC が 認証を受け、追加 となります。 |
2024/08/10 |
|
PCN(製品仕様変更通知書)
|
Supplier Notice No.:ESW490-58 Title: Alternative Epoxy Molding Compound for IXYS Brand Thyristor & Diode Discrete Packages
Description of Change: Littelfuse would like to notify you that we have qualified alternative Epoxy Moldi Compound (EMC) material for various IXYS Brand Thyristor & Diode Discrete Packages to serve the Business Continuity Plan (BCP).
Form, fit, function changes: No Fit/Form/Function change with alternative EMC
Effective date: August 10th, 2024 |