2021/02/09 |
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PCN(製品仕様変更通知書)
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Manufacturing Change : a new lead frame design |
2021/12/01 |
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PCN(製品仕様変更通知書)
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a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper wire with gold flash (CuPdAu) bond wire material assembled at MMT assembly site. |
2022/02/01 |
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PCN(製品仕様変更通知書)
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Product Change Notification Date: 01-Feb-2022
CCB 4539 Cancellation Notice: For the qualification of a new lead frame design for selected products available in 8L SOIC package using 8390A die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site |
2022/02/28 |
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PCN(製品仕様変更通知書)
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Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site. Estimated First Ship Date:February 28, 2022 |
2022/03/30 |
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PCN(製品仕様変更通知書)
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CCB 4993 Final Notice: Qualification of 3280 die attach material and new lead frame design for selected products available in 8L SOIC package assembled at MMT assembly site. Estimated First Ship Date:March 30, 2022 |