Unique tin-plated side pads of new leadless DFN1608D-2 package ease visual inspection of soldering and optimize PCB contact

 

Eindhoven, Netherlands and Hamburg, Germany, February 2, 2012 – NXP Semiconductors (NASDAQ: NXPI) today announced a major new benchmark in miniaturization with the launch of its next-generation family of low VF Schottky rectifiers targeting the mobile device market. With a typical thickness of just 0.37 mm and an outline of 1.6 x 0.8 mm, the new DFN1608D-2 (SOD1608) plastic package is the smallest on the market that is capable of carrying a current of up to 1.5A. The DFN1608D-2 has been released with a portfolio of six Schottky Barrier rectifiers: three 20V types optimized for very low forward voltage and three 40V types optimized for very low reverse current. Average forward current ranges between 0.5 and 1.5A.

 

In addition to offering significant space-saving options, NXP’s new Schottky rectifiers also deliver industry-leading power performance due to a huge heatsink at the package bottom. The very low forward voltage of these Schottky diodes reduces power consumption and thereby enables longer battery life in mobile devices. Typical applications include battery charging, display backlighting, switched-mode power supply (SMPS) and DC to DC conversion for small portable equipment. With the 1.5A types, these can be extended to larger devices such as tablet PCs.

 

The rectifiers in DFN1608D-2 are also attractive to manufacturers because of the package’s unique side pads, which are tin-plated to protect against oxidation, thereby always allowing side solderability. Unlike other leadless solutions where the soldered contacts remain hidden under the package, the side pads help avoid package tilting on the PCB, making it even flatter and maximizing stack density. The ability to solder the package at the side also enables easy visual inspection of the contact. By eliminating the need to inspect the solder contacts with expensive and complex x-ray equipment, the DFN1608D-2 makes the manufacturing process more cost-effective.

 

Dr. Wolfgang Bindke, product marketing manager for diodes at NXP Semiconductors, said: “These devices are a real breakthrough in terms of both miniaturization and current density for mobile device designers, giving them functionality options not previously available at this size. Tailored to the needs of ultra-thin applications such as smartphones, we have created the flattest leadless plastic package on the market for 1A and above, with performance parameters found only in devices more than four times larger in size today. This portfolio is another great example of innovative, customer-driven design from NXP.”

 

Features
 Average forward current: IF(AV) up to 1.5A
 Reverse voltage: VR up to 40V
 Low forward voltage VF down to 410 mV
 Low reverse current
 AEC-Q101 qualified
 Ultra small (only 1.6 x 0.8 mm), leadless SMD plastic package DFN1608D-2
 Tin-plated solderable side pads
 Package height typ. 0.37 mm

Availability
Already released and in mass production:
 PMEG2005EPK, 20V, 0.5A
 PMEG2010EPK, 20V, 1A

 

Design-in samples available, with mass production starting in March 2012:
 PMEG2015EPK, 20V, 1.5A
 PMEG4005EPK, 40V, 0.5A
 PMEG4010EPK, 40V, 1A
 PMEG4015EPK, 40V, 1.5A

Links
 SOD1608 package PIP page: http://www.nxp.com/packages/SOD1608.html
 Datasheet for PMEG2005EPK: http://www.nxp.com/documents/data_sheet/PMEG2005EPK.pdf
 Datasheet for PMEG2010EPK:
http://www.nxp.com/documents/data_sheet/PMEG2010EPK.pdf

 

About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.4 billion in 2010. Additional information can be found by visiting www.nxp.com.

 

Forward-looking Statements
This document includes forward-looking statements which include statements regarding NXP’s business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions; the ability to successfully introduce new technologies and products; the end-market demand for the goods into which NXP’s products are incorporated; the ability to generate sufficient cash, raise sufficient capital or refinance corporate debt at or before maturity; the ability to meet the combination of corporate debt service, research and development and capital investment requirements; the ability to accurately estimate demand and match manufacturing production capacity accordingly or obtain supplies from third-party producers; the access to production capacity from third-party outsourcing partners; any events that might affect third-party business partners or NXP’s relationship with them; the ability to secure adequate and timely supply of equipment and materials from suppliers; the ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly; the ability to form strategic partnerships and joint ventures and to successfully cooperate with alliance partners; the ability to win competitive bid selection processes to develop products for use in customers’ equipment and products; the ability to successfully establish a brand identity; the ability to successfully hire and retain key management and senior product architects; and, the ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and NXP’s business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, NXP’s market segments and product areas may develop. NXP has based these assumptions on information currently available, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While NXP does not know what impact any such differences may have on its business, if there are such differences, its future results of operations and its financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, www.nxp.com/investor or from the SEC website, www.sec.gov.

Companies Website:
http://components-asiapac.arrow.com/en/new_product/4139/

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